MSP430F4250REV

200 INR

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Product Details:

Soldermask Green
Test 100% Electrical Test
Voltage Endurance 500V
Min. Line Spacing 0.3 mm
Insulation Resistance >10^12
Min. Line Width 0.3 mm
Hole Size 0.2 mm
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Product Description

MSP430F4250REV Price And Quantity

Minimum Order Quantity 20 Piece
Price 200 INR

MSP430F4250REV Product Specifications

Soldermask Green
Test 100% Electrical Test
Hole Size 0.2 mm
Board Thickness 1.6 mm
Board Type Rigid
Electrical Components Yes
Surface Finish HASL
Voltage Endurance 500V
Color Green
Number Of Layers 1
Base Material FR-4
Sensor Switch No
Product Type Single Layer PCB
Min. Line Spacing 0.3 mm
Insulation Resistance >10^12
Min. Line Width 0.3 mm
Copper Thickness 1.6 mm
Flame Resistance Level UL94V-0
Silkscreen White
Panel Size TBD

MSP430F4250REV Trade Information

Main Domestic Market All India

Product Description

Specification

Connectivity	SPI, UART/USART
Speed	8MHz
Voltage Supply	1.8 V ~ 3.6 V (Vcc/Vdd)
Supplier Device Package	100-LQFP (14x14)
RAM Size	1K x 8
Program Memory Type	Flash
Program Memory Size	32KB (32K x 8 + 256B)
Peripherals	Brown-out Detect/Reset, LCD, POR, PWM, WDT
Part Status	Active
Packaging	Cut Tape (CT)
Package Case	100-LQFP
Oscillator Type	Internal
Operating Temperature	-40 deg C ~ 85 deg C (TA)
Number of IO	48 I/O
Data Converters	A/D 8x12b
Core Size	16-Bit
Core Processor	MSP430

Versatile Microcontroller Development

The MSP430F4250REV is engineered for flexibility in microcontroller-based development projects. Its compatibility with both through hole and surface mount components enables seamless integration into diverse electronic designs. Its flame-resistant, voltage-enduring FR-4 construction provides high insulation resistance, ensuring reliable operation in critical applications like automation and control systems.

Rigorous Quality and Compliance

Each MSP430F4250REV board undergoes a comprehensive 100% electrical test, adhering to strict industry standards. RoHS compliance guarantees environmentally safe materials, while UL94V-0 flame resistance offers an added layer of protection. The HASL surface finish coupled with a green soldermask enhances conductivity and durability, meeting the demands of professional and industrial use.

FAQs of MSP430F4250REV:

Q: How can the MSP430F4250REV be utilized in microcontroller development?

A: The MSP430F4250REV serves as a reliable platform for microcontroller prototyping, allowing engineers to implement, test, and refine embedded systems for various automation and control applications.

Q: What distinguishes the mounting options on the MSP430F4250REV board?

A: This board accommodates both through hole and SMT (surface mount technology) components, giving users flexibility in component placement and ease of assembly for different design requirements.

Q: When is it advisable to use this board for a new hardware project?

A: This board is ideal for new hardware projects during early prototyping and development stages due to its robust electrical testing, compliance standards, and reliable mechanical properties.

Q: Where can I purchase the MSP430F4250REV in India?

A: The MSP430F4250REV is available through a wide network of distributors, importers, manufacturers, suppliers, traders, and wholesalers across India.

Q: What is the process for ensuring quality in the MSP430F4250REV?

A: Quality assurance involves undergoing a 100% electrical test, utilizing flame-resistant FR-4 material, and conforming to industry standards such as RoHS and UL94V-0 certifications.

Q: How does the boards copper and board thickness benefit users?

A: With a copper and board thickness of 1.6 mm, the MSP430F4250REV provides reliable current carrying capacity and mechanical stability, which are crucial for consistent performance and strength in electronic assemblies.

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